IBM today announced that it will provide the microprocessors that will serve as the heart of the new Wii U system from Nintendo. The all-new, POWER-based microprocessor will pack some of IBM's most advanced technology into an energy-saving silicon package that will drive Nintendo's brand-new entertainment experience for consumers worldwide.

IBM plans to produce millions of chips for Nintendo featuring IBM Silicon on Insulator (SOI) technology at 45 nanometers (45 billionths of a meter). The custom-designed chips will be made at IBM's 300mm semiconductor development and manufacturing facility in East Fishkill, N.Y.

The inherent advantages of SOI technology make it a strong choice for performance-driven applications that demand exceptional, power-efficient processing capability–from entertainment consoles to supercomputers

"We're very proud to have delivered to Nintendo consistent technology advancements for three generations of entertainment consoles," said Elmer Corbin, director of IBM's custom chip business, in a press release. "Our relationship with Nintendo underscores our unique position in the industry--how we work together with clients to help them leverage IBM technology, intellectual property and research to drive innovation into their own core products."

The relationship between IBM and Nintendo dates to May 1999, when IBM was selected to design and manufacture the central microprocessor for the Nintendo GameCube system. Since 2006, IBM has shipped more than 90 million chips for Nintendo Wii systems. Nintendo plans for its new Wii U console to hit store shelves in 2012.